India Signs Loan Agreement with World Bank for US$ 250 Million

India Signs Loan Agreement with World Bank for US$ 250 Million for “Skills Acquisition and Knowledge Awareness for Livelihood Promotion” (SANKALP) Project  A Financing Agreement for IBRD loan of USD … Read More

The Executive Vice President, Devices & Services, Nokia, Mr. Stephen Elop meeting…

The Executive Vice President, Devices & Services, Nokia, Mr. Stephen Elop meeting the Union Minister for Commerce & Industry, Shri Anand Sharma, in New Delhi on September 10, 2013.